• Alloy Aluminum Skived Fin Heat Sink For CPU Cooling
  • Alloy Aluminum Skived Fin Heat Sink For CPU Cooling
Alloy Aluminum Skived Fin Heat Sink For CPU Cooling

Alloy Aluminum Skived Fin Heat Sink For CPU Cooling

Detail produk:

Tempat asal: Dongguan , Guangdong, Cina
Nama merek: Uchi
Sertifikasi: SMC
Nomor model: pendingin sirip skived 01

Syarat-syarat pembayaran & pengiriman:

Kuantitas min Order: 100 buah
Harga: dapat dinegosiasikan
Syarat-syarat pembayaran: T/T,paypal,Western Union,MoneyGram
Menyediakan kemampuan: 50000000pcs per bulan
Harga terbaik Kontak

Informasi Detail

Nilai: Seri 6000 Layanan Pemrosesan: Memotong, Meninju, Decoiling, Membungkuk, mengebor
Melunakkan: T3 ~ T8 Sedang mengemas: Karton TAS PE
Toleransi: ±1% Standar: Heatsink aluminium berkualitas menengah dan tinggi
Proses yang dalam: Pemesinan Cnc Bahan: Aluminium 6063
Menyoroti:

aluminum CPU heat sink

,

skived fin cooling plate

,

alloy heat sink for CPU

Deskripsi Produk

Alloy Aluminum Skived Fin Heat Sink For CPU Cooling
Customizable aluminum heatsink made from high-quality 6063 alloy, featuring precise CNC machining and anodized surface treatment for applications in LED lighting, electronics, and power supply equipment. Offers a tolerance of ±1% and versatile processing services including extruding, cutting, and drilling.
Material Aluminum 6063, 6061, etc. Accept Customization
Size Accept Customization
Color Black, Silver, Accept Customization
Customization Drill Holes, Silkscreen Printing, CNC etc.
Drawing PDF, 3D, CAD, JPG etc.
Surface Treatment Anodizing, Sand Blasting, Painting, Chromating and Laser marking
Processing Service Profiles Extruding - Cutting - CNC Machining - Drilling - Tapping - Deburring - Cleaning - Inspecting - Packing
Application LED Lighting, Inverter, Household Electrical Appliances, Welding Machine, Communication Device, Power Supply Equipment, Electronic Industry, Thermoelectric Coolers/Generator, etc.
Applications in High-end Manufacturing
Semiconductor and Chip Manufacturing
Advanced packaging technologies (e.g., 3D stacking) lead to heat accumulation inside chips, where the thermal conductivity of traditional materials has become a bottleneck.
AI Computing/Data Centers
With the surging heat flux density of chips, traditional cooling methods are struggling to meet the demand, making thermal management an "invisible ceiling" that restricts the improvement of computing power.
Aerospace
The space environment features extreme temperatures and high vacuum, where convective heat dissipation is not feasible. As a result, aerospace equipment is exposed to harsh temperature fluctuations.
Alloy Aluminum Skived Fin Heat Sink For CPU Cooling 0
Applications in Daily Life
Digital Devices
Internal heat dissipation modules composed of metal cooling fins are fitted in computers, mobile phones, game consoles and other devices to ensure their sustained performance.
Communication Devices
To guarantee the stability of high-speed data transmission and processing, these devices are usually equipped with large heat sinks.
Household Appliances
Compressors and external unit condensers require efficient heat dissipation performance, as they continuously transfer heat from indoor spaces to the outdoors.
Lighting Devices
Efficient heat dissipation design ensures the luminous efficacy and long service life of LED lamp beads; the realization of energy conservation is inseparable from the support of heat dissipation technology.
New Energy Vehicles
New energy vehicles require a sophisticated liquid cooling system to maintain an optimal operating temperature.
Alloy Aluminum Skived Fin Heat Sink For CPU Cooling 1
Pain Points in the Traditional Heat Dissipation Manufacturing Industry
  • Traditional air-cooling technology is no longer able to meet the heat flux density demand of over 50W/cm² for high-performance processors such as AI chips.
  • The performance of thermal conductive materials has hit a bottleneck, and the thermal conductivity coefficient of conventional thermal greases is difficult to exceed 5W/m*K.
  • Although liquid cooling technology delivers superior performance, it features complex production processes and high technical requirements.
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Product Transformation and Upgrading
The heat dissipation industry is undergoing a strategic transformation from a supporting industry to a key core technology sector. Its upgrading path is clearly defined:
  • In terms of technology, it is shifting from uniform heat dissipation to precision temperature control, with liquid cooling technology emerging as the mainstream solution
  • In terms of industrial positioning, it is transforming from a manufacturer to a "heat dissipation as a service" solution provider
  • In terms of material systems, it is evolving toward high thermal conductivity and intelligence
  • In terms of manufacturing paradigms, it is deeply integrating digitalization and additive manufacturing
Essentially, this transformation is an identity revolution from an auxiliary process to a leading design. Heat dissipation capacity has become one of the core indicators for measuring the competitiveness of the digital economy.
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Company Advantages
The mold workshop is equipped with 22 sets of electric discharge machines (EDM) of various types, including 2 MAKINO mirror EDM machines. It also has 9 wire-cut EDM machines (low-speed), among which 3 are Seibu wire-cut EDM machines and 1 is Sodick wire-cut EDM machine imported from Japan. In addition, the workshop is furnished with 7 spark erosion machines, 10 grinding machines, 2 milling machines and 1 lathe.
Powerful Equipment & Hardware Capabilities:
  • Table size: 500×350 mm
  • Rapid traverse speed: 5000 mm/min
  • Maximum workpiece weight: 500 kg
  • Maximum electrode weight: 50 kg
High Machining Precision:
Adopting the new SuperSpark4 and IES (Intelligent Expert System) technologies, we provide advanced adaptive power supply and jump control to stabilize the EDM process and improve machining precision simultaneously. Equipped with advanced ultra-surface and ultra-edge generator technologies, the workshop is capable of achieving excellent surface finish and metallurgical quality.
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Product Applications
Alloy Aluminum Skived Fin Heat Sink For CPU Cooling 8
Quality Assurance
We maintain rigorous quality standards with comprehensive testing equipment including:
  • 1 Coordinate Measuring Machine
  • 1 projector instrument
  • 2 water high pressure testing machines
  • 4 thermal resistance testing machines
  • 2 liquid leakage testing machines
Alloy Aluminum Skived Fin Heat Sink For CPU Cooling 9
Customer Service Commitment
  • Prompt response to all inquiries
  • Competitive pricing with guaranteed quality
  • Efficient production scheduling
  • Optimal transportation solutions
  • Comprehensive technical support
Frequently Asked Questions
Are you a trading company or manufacturer?
We are a professional manufacturer of heat sinks and water cooling plates with extensive experience and a strong technical team, featuring automated and mechanized production.
Have you exported goods before and to which regions?
60% of our total production is exported to Japan, India, UK, Canada, USA, and Brazil.
How many employees do you have?
Approximately 100 employees across sales, purchasing, engineering, QA, warehouse, and production departments.
Can you provide samples if we agree with the design?
Yes, we provide samples for confirmation before mass production, along with technical drawings if required.
What packing methods do you use?
Customized packing with normal cartons and tight-proof fabric or wooden cartons for optimal protection during transportation.
Do you provide technical support for product issues?
All products are fully inspected before shipping. For any issues, we provide immediate technical solutions.

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