• Split-type Pure Copper Microchannel Cold Plate (Dual Heat Source Microchannel Liquid Cooling Heat Sink)
  • Split-type Pure Copper Microchannel Cold Plate (Dual Heat Source Microchannel Liquid Cooling Heat Sink)
  • Split-type Pure Copper Microchannel Cold Plate (Dual Heat Source Microchannel Liquid Cooling Heat Sink)
  • Split-type Pure Copper Microchannel Cold Plate (Dual Heat Source Microchannel Liquid Cooling Heat Sink)
Split-type Pure Copper Microchannel Cold Plate (Dual Heat Source Microchannel Liquid Cooling Heat Sink)

Split-type Pure Copper Microchannel Cold Plate (Dual Heat Source Microchannel Liquid Cooling Heat Sink)

Detail produk:

Tempat asal: Dongguan, Guangdong, Tiongkok
Nama merek: UCHI
Sertifikasi: UL.VDE,SGS,REACH,CQC,CSA.ISO.ROHS,CUL

Syarat-syarat pembayaran & pengiriman:

Kuantitas min Order: 1000 buah
Harga: dapat dinegosiasikan
Kemasan rincian: dalam jumlah besar
Waktu pengiriman: 5-7 hari
Syarat-syarat pembayaran: T/T, Paypal, Western Union, Uang gram
Menyediakan kemampuan: 5000.000.000PCS Per Bulan
Harga terbaik Kontak

Informasi Detail

Bahan: paduan tembaga + aluminium Ukuran: 120*150*35mm
Media yang berlaku: untuk penggantian/perbaikan Teknologi produk: Pemesinan CNC + penyelesaian permukaan
Melayani: Layanan Kustom OEM Sedang mengemas: Karton TAS PE
Jaminan: 3 tahun Masukan Saat Ini: ≤10A
Bahan: Tembaga/aluminium Kebisingan: 17dbA
Bantalan: Bantalan Paduan Fitur: Transmisi air bertekanan tinggi
Jenis Pendingin: Jenis Pendingin
Menyoroti:

Split-type Pure Copper Cold Plate

,

Dual Heat Source Liquid Cooling Plate

,

Microchannel Heat Sink with Warranty

Deskripsi Produk

Split-type Pure Copper Microchannel Cold Plate (Dual Heat Source Microchannel Liquid Cooling Heat Sink) Structural Interpretation Dual Independent Microchannel Zones Two sets of pure copper microchannel heat exchange regions with fine grooves can be seen on the left and right, corresponding to two heat-generating chips (such as dual GPUs, dual RF chips, or dual laser bars). An isolation trench is reserved in the middle to realize zoned heat dissipation for heat sources, which

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